plasma-enhanced chemical vapour deposition abbr., PECVD (rus. плазменно-химическое осаждение из газовой фазы otherwise плазмохимическое газофазное осаждение; осаждение из паровой фазы; стимулированное плазмой abbr., ПХО; ПХГФО) — a process of chemical deposition of thin films from a vapour phase enhanced by high-frequency plasma.


In the plasma-enhanced chemical deposition process, gas discharge plasma is used to decompose a reaction gas into active radicals. The application of different methods of plasma generation in a reaction volume and adjustment of plasma parameters makes it possible to expedite the growth of coatings and deposit amorphous and polycrystalline films at much lower substrate temperatures, as well as enabling greater control of the generation of the target micropattern, structure, impurity composition and other characteristics of the coating than similar chemical vapour deposition (CVD) processes based on the thermal decomposition of reaction gas.


  • Zhuravleva Natalya G.
  • Naymushina Daria A.


  1. Nanotechnology STC 2006., —
  2. Advanced Plasma Technology (in Russian) // Intech 2008, —

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